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2DB1188P/Q/R
PNP SURFACE MOUNT TRANSISTOR
Features NEW PRODUCT
* * * * * * Epitaxial Planar Die Construction Complementary NPN Type Available (2DD1766) Ideally Suited for Automated Assembly Processes Ideal for Medium Power Switching or Amplification Applications Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2)
SOT89-3L
Mechanical Data
* * * * * * * Case: SOT89-3L Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminals: Finish -- Matte Tin annealed over Copper leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Marking & Type Code Information: See Page 3 Ordering Information: See Page 3 Weight: 0.072 grams (approximate) @TA = 25C unless otherwise specified Symbol VCBO VCEO VEBO ICM IC Value -40 -32 -5 -3 -2 Unit V V V A A
3E C4 2C 1B TOP VIEW
COLLECTOR 2,4
1 BASE 3 EMITTER
Schematic and Pin Configuration
Maximum Ratings
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Peak Pulse Current Continuous Collector Current
Thermal Characteristics
Characteristic Power Dissipation (Note 3) @ TA = 25C Thermal Resistance, Junction to Ambient Air (Note 3) @ TA = 25C Operating and Storage Temperature Range Symbol PD RJA Tj, TSTG Value 1 125 -55 to +150 Unit W C/W C
Electrical Characteristics
Characteristic OFF CHARACTERISTICS (Note 4) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cut-Off Current Emitter Cut-Off Current ON CHARACTERISTICS (Note 4) Collector-Emitter Saturation Voltage DC Current Gain SMALL SIGNAL CHARACTERISTICS Transition Frequency Output Capacitance
Notes: 1. 2. 3. 4.
@TA = 25C unless otherwise specified Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO VCE(SAT) 2DB1188P 2DB1188Q 2DB1188R hFE Min -40 -32 -5 82 120 180 Typ -0.35 120 20 Max -1 -1 -0.8 180 270 390 Unit V V V A A V MHz pF Conditions IC = -50A, IE = 0 IC = -1mA, IB = 0 IE = -50A, IC = 0 VCB = -20V, IE = 0 VEB = -4V, IC = 0 IC = -2A, IB = -0.2A VCE = -3V, IC = -0.5A
fT Cob
IE = 0.1A, VCE = -5V, f = 30MHz VCB = -10V, IE = 0, f = 1MHz
No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. Measured under pulsed conditions. Pulse width = 300s. Duty cycle 2%.
DS31144 Rev. 4 - 2
1 of 4 www.diodes.com
2DB1188P/Q/R
(c) Diodes Incorporated
1.0
PD, POWER DISSIPATION (W)
0.8
NEW PRODUCT
0.6
0.4
0.2
0 0 25 50 100 125 75 TA, AMBIENT TEMPERATURE (C) Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3) 150
VCE = -3V TA = 150C
IC/IB = 10
TA = 85C
TA = 25C
TA = 150C
TA = -55C
TA = 85C
TA = 25C TA = -55C
0.001
0.01
0.1
1
10
VCE = -3V
TA = -55C
TA = -55C
TA = 25C
TA = 25C TA = 85C
TA = 85C
TA = 150C
TA = 150C
IC /IB = 10
DS31144 Rev. 4 - 2
2 of 4 www.diodes.com
2DB1188P/Q/R
(c) Diodes Incorporated
f = 1MHz
NEW PRODUCT Ordering Information (Note 5)
Device 2DB1188P-13 2DB1188Q-13 2DB1188R-13
Notes: 5.
Packaging SOT89-3L SOT89-3L SOT89-3L
Shipping 2500/Tape & Reel 2500/Tape & Reel 2500/Tape & Reel
For packaging details, go to our website at http://www.diodes.com/ap02007.pdf.
Marking Information
(Top View)
YWW P23x
P23x = Product Type Marking Code: Where P23P = 2DB1188P P23Q = 2DB1188Q P23R = 2DB1188R YWW = Date Code Marking Y = Last digit of year ex: 7 = 2007 WW = Week code 01 - 52
Package Outline Dimensions
D1
0 20 0. R
SOT89-3L
C
Dim A B
Min 1.40 0.45 0.37 0.35 4.40 1.50 2.40 -- 3.95 0.90
Max 1.60 0.55 0.47 0.43 4.60 1.70 2.60 -- 4.25 1.20
Typ 1.50 0.50 0.42 0.38 4.50 1.60 2.50 1.50 4.10 1.05
E H
B1 C D D1 E e
B B1 8 e
(4X )
L
A
H L
D
All Dimensions in mm
DS31144 Rev. 4 - 2
3 of 4 www.diodes.com
2DB1188P/Q/R
(c) Diodes Incorporated
Suggested Pad Layout NEW PRODUCT
1.7
2.7
0.4 1.9 1.3
0.9 3.0 Unit: mm
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
DS31144 Rev. 4 - 2
4 of 4 www.diodes.com
2DB1188P/Q/R
(c) Diodes Incorporated

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